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- VAR-SOM-MX8M-MINI NXP i.MX 8M Mini
VAR-SOM-MX8M-MINI
NXP i.MX 8M Mini
The VAR-SOM-MX8M-MINI is a highly scalable, low power System on Module (SoM) / Computer on Module (CoM) , offering a mainstream solution to fit a wide range of applications and cost requirements.
Based on NXP’s i.MX 8M Mini with up to 1.8GHz Quad-core ARM Cortex-A53™ plus 400MHz Cortex-M4™ real-time processor and up to 4 GB DDR4, the VAR-SOM-MX8M-MINI supports advanced features and a variety of connectivity options, including integrated HW engines supporting 1080p video encoding and decoding, 2D and 3D graphics, HQ audio, integrated certified WiFi 6 dual-band 802.11ax/ac/a/b/g/n with Bluetooth/BLE 5.4 and optional 802.15.4, integrated CAN bus, LVDS, and a variety of additional interfaces.
The VAR-SOM-MX8M-MINI integrates into Variscite's VAR-SOM Pin2Pin family, providing scalability across the full performance spectrum and reducing time-to-market when migrating between platforms.
For the complete Pin2pin product list, check the Variscite Pin2Pin System on Module families.
** The Pin2Pin compatibility depends on pinmux options; please verify the detailed pinout table in the related SoM to confirm compatibility is maintained in your specific design.
Starting from
70
$
Highlights
CPU
Up to 1.8GHz Quad Cortex™-A53 NXP i.MX 8M Mini
Dimensions
67.8 x 33mm
Certified WiFi/Bluetooth
WiFi 6 802.11ax/ac/a/b/g/n with optional 802.15.4 and Bluetooth/BLE 5.4
Temperature range
-40 to 85°C
Multimedia
1080p60 Encode, Decode and display, HQ audio, HD GPU
Product Longevity
2034
Support
Supporting you every step of the way - from ideation to launch and beyond.
Free and prompt support directly from Variscite’s R&D experts.
Quick Links
Specifications
CPU Name
NXP i.MX8M Mini
CPU Type
Cortex™-A53
CPU Cores
4 Cores
CPU Clock (Max)
Up to 1.8GHz
Real-time co-processor
400MHz Cortex™-M4
Integer performance (DMIPS)
Up to 16,560
RAM
1 – 4 GB DDR4
eMMC
8 – 128 GB
Multimedia
2D/3D Graphics Acceleration
Vivante GC320/GC NanoUltra
Video Encode / Decode
1080p60 H.265/H.264/VP9 Decode, 1080p60 H.264/VP8 Encode
Camera Interfaces
MIPI-CSI2
Display
DSI
MIPI-DSI 1920×1080 24-bit
LVDS
Dual 1920x1080 24-bit
Touch controller
Resistive, Capacitive
Audio
Headphone driver
Yes
Microphone
Digital, Analog (stereo)
Digital audio serial interface
5 x I2S(SAI), S/PDIF, PDM 4CH
Line In/Out
Yes
Connectivity
SD / MMC
x1
USB Host / Device
USB2.0: 2x OTG
UART
x4, up to 4 Mbps
I2C
x3
SPI
x3
CAN Bus
CAN/CAN-FD (Flexible Data-Rate)
RTC
On carrier
JTAG
x1 (via optional header)
PCI-Express
Gen 2.0
Networking
Ethernet
10/100/1000 Mbps
WiFi
V1: Certified WiFi 5 dual-band 802.11 ac/a/b/g/n
V2: Certified WiFi 6 dual-band 802.11ax/ac/a/b/g/n with optional 802.15.4, Matter
V2: Certified WiFi 6 dual-band 802.11ax/ac/a/b/g/n with optional 802.15.4, Matter
Bluetooth
V1: Bluetooth/BLE 5.2
V2: Bluetooth/BLE 5.4
V2: Bluetooth/BLE 5.4
Linux
Yocto, Debian, Boot2Qt
Android
Yes
FreeRTOS
Yes
Mechanical Specifications
Dimensions (W x L)
67.8 x 33.0 mm
Electronic Specifications
Supply voltage
3.3 V
Digital I/O voltage
3.3 V
Environmental Specifications
Commercial operating temperature
0 to 70°C
Extended operating temperature
0 to 85°C
Industrial operating temperature
-40 to 85°C
Storage temperature
-40 to 85°C
Storage humidity
5% to 95%
VAR-SOM-MX8MM[x]_V2_[xxxx]C_[xxxx]R_[xx]G_[AC]_[EC]_[LD]_[TP]_[CN]_[WBD/ WBE]_[X]T
MX8MM[x]:
CPU type: Quad : [Q]
[xxxx]C:
CPU clock speed: 1800MHz: 1800C (CT/ET grade), 1600MHz: 1600C (IT grade)
[xxxx]R:
DDR4: 1024 MB: 1024R, 2048 MB: 2048R, 4096 MB: 4096R
[xx]G:
eMMC: 8 GB : 8G, 16 GB : 16G, 32 GB : 32G, 64 GB : 64G, 128 GB : 128G
[AC]:
Audio Codec
[EC]:
GbE PHY
[LD]:
LVDS interface
[TP]:
Resistive touch panel controller
[CN]:
CAN bus bridge
[WBD/WBE]
V2 WiFi/Bluetooth:
WBD: Built-in certified WiFi 6 dual band 802.11ax/ac/a/b/g/n + Bluetooth/BLE 5.4
WBE: Built-in certified WiFi 6 dual band 802.11ax/ac/a/b/g/n + Bluetooth/BLE 5.4 + 802.15.4
WBD: Built-in certified WiFi 6 dual band 802.11ax/ac/a/b/g/n + Bluetooth/BLE 5.4
WBE: Built-in certified WiFi 6 dual band 802.11ax/ac/a/b/g/n + Bluetooth/BLE 5.4 + 802.15.4
[x]T:
C : 0 to 70°C, E: 0 to 85°C, I : -40 to 85°C
VAR-SOM-MX8MM[x]_[xxxx]C_[xxxx]R_[xx]G_[AC]_[EC]_[LD]_[TP]_[CN]_[WB[D]]_[X]T
MX8MM[x]:
CPU type: Quad : [Q]
[xxxx]C:
CPU clock speed: 1800MHz: 1800C (CT/ET grade), 1600MHz: 1600C (IT grade)
[xxxx]R:
DDR4: 1024 MB: 1024R, 2048 MB: 2048R, 4096 MB: 4096R
[xx]G:
eMMC: 8 GB : 8G, 16 GB : 16G, 32 GB : 32G, 64 GB : 64G, 128 GB : 128G
[AC]:
Audio Codec
[EC]:
GbE PHY
[LD]:
LVDS interface
[TP]:
Resistive touch panel controller
[CN]:
CAN bus bridge
[WB[D]]
WB: Built-in certified single band WiFi 802.11 b/g/n + Bluetooth 5.1/BLE
WBD: Built-in certified dual band WiFi 802.11 ac/a/b/g/n + Bluetooth 5.2/BLE
WBD: Built-in certified dual band WiFi 802.11 ac/a/b/g/n + Bluetooth 5.2/BLE
[x]T:
C : 0 to 70°C, E: 0 to 85°C, I : -40 to 85°C
Note: All options in [brackets] are optional add-ons that can be either removed or selected from a list of options
Documentation
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Our close partnerships with leading technology vendors provide our customers with early access to the latest advanced solutions, ensuring your projects begin with a solid and future-ready foundation.
Evaluation Kit
VAR-SOM-MX8M-MINI Evaluation Kits
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Why Variscite?
Quality
In-house manufacturing with comprehensive quality control - certified to ISO9001 and ISO13485 medical standards.
Pin2Pin
Our Pin2Pin product families maximize scalability and enable seamless migration to future technologies without redesigning the carrier board.
Longevity
15-year guaranteed hardware availability, backed by continuous software updates and support.
Customizability
Configure your system with precision and flexibility - select only the features you need and reduce costs.
Updates
09.10.2024 Software releases
Stay current with software updates – Keep your Variscite SoMs performing at their best with our latest software releases.
16.06.2026
Newsroom
Global component shortages are putting embedded projects under pressure. As a leading global System on Modules (SoMs) developer and manufacturer, we keep our customers’ development timelines on track by applying a supply chain strategy built on buffered inventories, in-house production, established relationships with multiple suppliers, and more than two decades of operational experience.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
21.06.2026
Blog
Your OS Decision Matters
29.04.2026
