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System On Module- TI Sitara AM62x
- VAR-SOM-AM62 TI Sitara AM62x
VAR-SOM-AM62
TI Sitara AM62x
The VAR-SOM-AM62 is a cost-effective System on Module (SoM) / Computer on Module, combining a high-performance CPU, reduced power consumption and graphics capabilities.
Powered by 1.4GHz Quad Cortex™-A53 TI Sitara AM625 with 400MHz Cortex-M4F and 333MHz PRU real-time co-processors, the SoM provides an ideal solution for industrial embedded products and power-sensitive edge devices.
This highly integrated platform’s connectivity options include certified single or dual-band WiFi, Bluetooth/BLE5.2, 3x CAN Bus, dual GbE, audio, camera in and dual USB. The platform supports full -40 to 85C industrial operating temperatures, an integrated GPU graphics acceleration engine a dual LVDS display interface and security features.
The VAR-SOM-AM62 is fully compatible with Variscite's VAR-SOM Pin2Pin family, offering maximum flexibility from cost-effective entry-level options to advanced, high-performance modules.
* For the complete Pin2Pin product list, check out Variscite’s Pin2Pin System on Module product families.
** The Pin2Pin compatibility depends on pinmux options; please verify the detailed pinout table in the related SoM to confirm compatibility is maintained in your specific design.
Starting from
53
$
Highlights
CPU
Up to 1.4GHz Quad Cortex-A53 Texas Instruments Sitara AM625
High Speed Interfaces
2x USB2.0, 2x GbE
Certified WiFi/Bluetooth
802.11 ac/a/b/g/n + Bluetooth/BLE 5.2
Temperature range
-40 to 85°C
Real-time CPU
400MHz Cortex-M4F and 333MHz PRU
Product Longevity
2038
Support
Supporting you every step of the way - from ideation to launch and beyond.
Free and prompt support directly from Variscite’s R&D experts.
Quick Links
Specifications
CPU Name
Texas Instruments AM62x
CPU Type
Cortex-A53
CPU Cores
4 Cores
CPU Clock (Max)
Up to 1.4GHz
Real-time co-processor
400MHz Cortex-M4F and 333MHz PRU (Programmable Realtime Unit)
Integer performance (DMIPS)
Up to 12,880
RAM
512MB – 4GB DDR4
eMMC
8 – 128 GB
Multimedia
2D/3D Graphics Acceleration
Imagination AXE-1-16M
Camera Interfaces
MIPI-CSI2
Display
LVDS
Dual 1920×1080 24-bit
Touch controller
Resistive, Capacitive
Audio
Headphone driver
Yes
Microphone
Digital, Analog (stereo)
Digital audio serial interface
3 x I2S(McASP)
Line In/Out
Yes
Connectivity
SD / MMC
x1
USB Host / Device
USB 2.0: 2x OTG
UART
x9, up to 3.6 Mbps
I2C
x5
SPI
x5
CAN Bus
x3
RTC
On carrier
JTAG
x1
QSPI
x1 / x2
GPMC
GPMC for external 8/16-bit parallel bus
Networking
Ethernet
2x 10/100/1000 Mbps
WiFi
Certified single-band 802.11 b/g/n or dual-band 802.11 ac/a/b/g/n
Bluetooth
Bluetooth/BLE 5.2
Linux
Yocto, Debian, Boot2Qt
Android
Yes
FreeRTOS
Yes
Mechanical Specifications
Dimensions (W x L)
67.8 x 33mm
Electronic Specifications
Supply voltage
3.3V
Digital I/O voltage
3.3V
Environmental Specifications
Extended operating temperature
0 to 85°C
Industrial operating temperature
-40 to 85°C
Storage temperature
-40 to 85°C
Storage humidity
5% to 95%
VAR-SOM-AM625[x]_[xxxx]C_[xxxx]R_[xx]G_[AC]_[EC]_[TP]_[WB[D]]_[OSPI/GPMC/MMC2]_[RG2CM]_[X]T
AM625[x]:
Processor type:
TI 6252 dual core: 2
TI 6254 quad core: 4
TI 6252 dual core: 2
TI 6254 quad core: 4
[xxxx]C:
CPU clock speed: 1400MHz: 1400C
[xxxx]R:
DDR4: 512MB: 512R, 1024 MB: 1024R, 2048 MB: 2048R, 4096 MB: 4096R
[xx]G:
eMMC: 8 GB : 8G, 16 GB : 16G, 32 GB : 32G, 64 GB : 64G, 128 GB : 128G
[AC]:
Audio Codec
[EC]:
GbE PHY (second port always via RGMII)
[TP]:
Resistive touch panel controller
[WB[D]]
WB: Built-in certified single band WiFi 802.11 b/g/n + Bluetooth 5.1/BLE
WBD: Built-in certified dual band WiFi 802.11 ac/a/b/g/n + Bluetooth 5.2/BLE
WBD: Built-in certified dual band WiFi 802.11 ac/a/b/g/n + Bluetooth 5.2/BLE
[OSPI/GPMC/MMC2]
Default: No extra interface
OSPI: Extra Octa/Quad/Dual SPI
GPMC: Extra parallel bus
MMC2: Extra SDIO/MMC2 (available only without WB/W)
OSPI: Extra Octa/Quad/Dual SPI
GPMC: Extra parallel bus
MMC2: Extra SDIO/MMC2 (available only without WB/W)
[RG2CM]
Default: 3.3V over the RGMII pins
RG2CM: 1.8V over the RGMII pins
RG2CM: 1.8V over the RGMII pins
[x]T:
E: 0 to 85°C, I : -40 to 85°C (note: PRU available only in IT grade)
Note: All options in [brackets] are optional add-ons that can be either removed or selected from a list of options
Documentation
Our Long-Standing Partnerships
Our close partnerships with leading technology vendors provide our customers with early access to the latest advanced solutions, ensuring your projects begin with a solid and future-ready foundation.
Evaluation Kit
VAR-SOM-AM62 Evaluation Kits
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Why Variscite?
Quality
In-house manufacturing with comprehensive quality control - certified to ISO9001 and ISO13485 medical standards.
Pin2Pin
Our Pin2Pin product families maximize scalability and enable seamless migration to future technologies without redesigning the carrier board.
Longevity
15-year guaranteed hardware availability, backed by continuous software updates and support.
Customizability
Configure your system with precision and flexibility - select only the features you need and reduce costs.
Updates
09.10.2024 Software releases
Stay current with software updates – Keep your Variscite SoMs performing at their best with our latest software releases.
16.06.2026
Newsroom
Global component shortages are putting embedded projects under pressure. As a leading global System on Modules (SoMs) developer and manufacturer, we keep our customers’ development timelines on track by applying a supply chain strategy built on buffered inventories, in-house production, established relationships with multiple suppliers, and more than two decades of operational experience.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.
21.06.2026
Blog
Your OS Decision Matters
29.04.2026
