

7" WVGA
Capacitive
VAR-STK-SOLO / VAR-STK-DUAL
VAR-DVK-SOLO / VAR-DVK-DUAL
NXP i.MX6
NXP i.MX6
Cortex-A9
Cortex-A9
1
2
1 GHz
1 GHz
1024 MB
1024 MB
512 MB SLC NAND
512 MB SLC NAND
8 GB
8 GB
Ethernet PHY
Ethernet PHY
Certified WiFi 802.11 b/g/n
Certified WiFi 802.11 b/g/n
Bluetooth 5.1 + CSA2 support / BLE
Bluetooth 5.1 + CSA2 support / BLE
Yes
Yes
4-wire Touch
4-wire Touch
Linux / Android
Linux / Android
0 to 70°C
0 to 70°C
[tooltip]VAR_SOM_SOLO_1000C_1024R_512N_8G_AC_EC_TP_WB_CT[/tooltip]
[tooltip]VAR_SOM_DUAL_1000C_1024R_512N_8G_AC_EC_TP_WB_CT[/tooltip]
Supporting the VAR-SOM-SOLO/DUAL
3 pair 18-bit, 4 pair 24-bit
1.4
4-wire touch panel, (4-pin FFC/FPC)
Capacitive touch panel, (6-pin FFC/FPC)
3.5 mm connector
3.5 mm connector
on-board
Serial/MIPI CMOS sensor interface
uSD Card Socket
1 port, Type A connector
Starter kit
Development kit
L: Linux, A: Android
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As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.







