

7" WVGA
Capacitive
VAR-STK-6UL
VAR-DVK-6UL
NXP i.MX6 UltraLite / i.MX 6ULL
NXP i.MX6 UltraLite / i.MX 6ULL
Cortex-A7
Cortex-A7
1
1
900 MHz
900 MHz
512 MB
512 MB
512 MB SLC NAND
8 GB
Ethernet PHY
Ethernet PHY
Certified WiFi 6 dual band 802.11ax/ac/a/b/g/n
Certified WiFi 6 dual band 802.11ax/ac/a/b/g/n
Bluetooth 5.4/ BLE
Bluetooth 5.4/ BLE
Yes
Yes
Linux
Linux
0 to 70°C
0 to 70°C
DART-6UL-5G_V2_Y2_900C_512R_8N_AC_EC_WBD_CT
DART-6UL-5G_V2_Y2_900C_512R_05N_AC_EC_WBD_CT
Supporting the DART-6UL (not included)
24 bit
3 pair 18-bit
Capacitive touch panel, (6-pin FFC/FPC)
Header
3.5 mm connector
3.5 mm connector
on-board
Parallel CMOS sensor interface
uSD Card Socket
1 port, Type A connector
Including DART-6UL-5G_V2_Y2_900C_512R_05N_AC_EC_WBD_CT
Including DART-6UL-5G_V2_Y2_900C_512R_8N_AC_EC_WBD_CT
STK: Starter kit
DVK: Development kit
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As AI-driven demand accelerated through 2025, memory chip shortages developed as semiconductor manufacturers shifted capacity to large-volume buyers, leaving many sectors, including medical, industrial, edge/IoT, and robotics poorly served. Climbing prices and lengthening lead times, exacerbated by knock-on effects across other SoM components, have created two clear pressure points. SoM vendors relying on outsourced manufacturing have limited flexibility when availability drops, leaving customers facing the same delays. Separately, product developers who chose chip-down architectures over SoM-based designs must procure components on their own. Those buying in smaller quantities are routinely pushed down supplier priority lists, and in many cases cannot get supply at all.







